95.5% Tin (Sn) / 4% Silver (Ag) / 0.5% Copper (Cu) Silver-Bearing Lead-Free Rosin-Core Solder, 0.032″ Diameter – 0.6 oz.

95.5% Tin (Sn) / 4% Silver (Ag) / 0.5% Copper (Cu) Silver-Bearing Lead-Free Rosin-Core Solder, 0.032" Diameter – 0.6 oz.

95.5% Tin (Sn) / 4% Silver (Ag) / 0.5% Copper (Cu) Silver-Bearing Lead-Free Rosin-Core Solder, 0.032″ Diameter – 0.6 oz.

$12.99

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Description

Get reliable soldering performance with our high quality silver-bearing lead-free rosin-core solder. This 95.5% tin, 4% silver, and 0.5% copper alloy is designed for electronics repair, circuit board work, wiring, and general soldering applications. The 0.032″ diameter solder provides precise control for detailed work, while the convenient dispenser pack makes application easy.

Key Features:

  • Silver-bearing, lead-free rosin-core solder
  • Alloy composition: 95.5% tin (Sn) / 4% silver (Ag) / 0.5% copper (Cu)
  • 0.032″ diameter / 21 AWG
  • 0.6 oz dispenser pack
  • Reflow temperature: 217–219°C
  • Ideal for electronics repair, PCB work, component installation, wiring, and general soldering
  • Convenient dispenser packaging for controlled solder application
  • Lead-free formulation for applications requiring lead-free solder

Specifications:

  • Part No.: 50-21700
  • UPC: 038975502175
  • Diameter: 0.032″
  • Gauge: 21 AWG
  • Weight: 0.6 oz dispenser pack
  • Alloy: Sn 95.5% / Ag 4% / Cu 0.5%
  • Reflow Temperature: 217–219°C

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